SA408FG Thermally conductive double-sided adhesive tape
Details
SA408FG Thermally conductive double-sided adhesive tape
Product features:
SA408FG thermal conductive double-sided adhesive is widely used in the bonding of heat sink to the microprocessor and other power consumption on the semiconductor.
SA408FG thermal double-sided adhesive has strong adhesive strength, and thermal resistance small, can effectively replace the grease and mechanical fixation
1.0W/m-K thermal conductivity
High strength viscosity is suitable for all kinds of surface
Double sided pressure sensitive adhesive tape
Acrylic adhesive with high thermal conductivity
Application
LED Lighting products
Chassis, frame and other heat sink assemblies
Large capacity driver
Heat pipe assembly
Thermal conductivity of LED display lamp
High frequency micro processing chip
Notebook and desktop computers
Square, flexible packaging lithium battery rapid fixation and conduction
Test condition
Pressure(Psi) | Temperature（℃） | frequency（see） |
10 | 25 | 15 |
30 | 25 | 6 |
10 | 80 | 6 |
30 | 80 | 3 |
SA408FG General features |
Product item | SA408FG | *** |
Color | White | Visual |
base material | glass grid /PET | No FG suffix for no substrate model |
Thickness（mm） | 0.2±0.01 | ASTM D374 |
breakdown voltage（V） | >4000 | ASTM D149 |
Peel strength | 1.8kg/25mm | PSTC-3 |
shear strength 1.0 | >48hrs | PSTC-3 |
Kg loading on 25 mm x 25mm |
heat resistant strength 0.5kg | >24hrs | *** |
Loading on 25mm x 25mm at 80 ℃ |
Thermal conductivity (W/mk) | 1.0 W/mk | ASTMD 5470 |
Operating temperature | -30℃～130℃ | *** |
Flammability | glass grid (HB) /PET (V0) | UL |
